The Wassenaar Arrangement - Dual-Use and Munitions Lists - July 1996
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2.A. SYSTEMS, EQUIPMENT AND COMPONENTS
(For quiet running bearings, see Item 9 on the Munitions List.)*
2.A.1. Anti-friction bearings and bearing systems, as follows, and components therefor:
Note: 2.A.1. does not control balls with tolerances specified by the manufacturer in accordance with ISO 3290 as grade 5 or worse.
a. Ball bearings and solid roller bearings having tolerances specified by the manufacturer in accordance with ABEC 7, ABEC 7P, ABEC 7T or ISO Standard Class 4 or better (or national equivalents), and having rings, balls or rollers made from monel or beryllium;Note; 2.A.1.a. does not control tapered roller bearings.
b. Other ball bearings and solid roller bearings having tolerances specified by the manufacturer in accordance with ABEC 9, ABEC 9P or ISO Standard Class 2 or better (or national equivalents);
Note: 2.A.1.b. does not control tapered roller bearings.
c. Active magnetic bearing systems using any of the following:
1. Materials with flux densities of 2.0 T or greater and yield strengths greater than 414 MPa;2. All-electromagnetic 3D homopolar bias designs for actuators; or
3. High temperature (450 K (177°C) and above) position sensors.
2.B. TEST, INSPECTION AND PRODUCTION EQUIPMENT
Technical Notes
1. Secondary parallel contouring axes, (e.g., the w-axis on horizontal boring mills or a secondary rotary axis the centre line of which is parallel to the primary rotary axis) are not counted in the total number of contouring axes.
N.B. Rotary axes need not rotate over 360. A rotary axis can be driven by a linear device (e.g., a screw or a rack-and-pinion).
2. Axis nomenclature shall be in accordance with International Standard
ISO 841, 'Numerical Control Machines - Axis and Motion Nomenclature'.
3. For the purposes of this Category a "tilting spindle" is counted as
a rotary axis.
_________________
* France and the Russian Federation view this list as reference drawn up to help in the selection of dual-use goods which could contribute to the indigenous development, production or enhancement of conventional munitions capabilities.
4. Guaranteed positioning accuracy levels instead of individual test
protocols may be used for each machine tool model using the agreed ISO test
procedure.
5. The positioning accuracy of "numerically controlled" machine tools
is to be determined and presented in accordance with ISO 230/2.
2.B.1. Machine tools, as follows, and any combination thereof, for removing (or cutting) metals, ceramics or "composites", which, according to the manufacturer's technical specification, can be equipped with electronic devices for "numerical control":
a. Machine tools for turning, having all of the following characteristics:1. Positioning accuracy with all compensations available of less (better) than 6 µm along any linear axis (overall positioning); and2. Two or more axes which can be coordinated simultaneously for "contouring control";
Note 2.B.1.a. does not control turning machines specially designed for the production of contact lenses.
b. Machine tools for milling, having any of the following characteristics:
1.a. Positioning accuracy with all compensations available of less (better) than 6 µm along any linear axis (overall positioning); andb. Three linear axes plus one rotary axis which can be coordinated simultaneously for "contouring control";
2. Five or more axes which can be coordinated simultaneously for "contouring control"; or
3. A positioning accuracy for jig boring machines, with all compensations available, of less (better) than 4 µm along any linear axis (overall positioning);
c. Machine tools for grinding, having any of the following characteristics:
1.a. Positioning accuracy with all compensations available of less (better) than 4 µm along any linear axis (overall positioning); andb. Three or more axes which can be coordinated simultaneously for "contouring control"; or
2. Five or more axes which can be coordinated simultaneously for "contouring control";
Note 2.B.1.c. does not control grinding machines, as follows:1. Cylindrical external, internal, and external-internal grinding machines having all the following characteristics:a. Limited to cylindrical grinding; andb. Limited to a maximum workpiece capacity of 150 mm outside diameter or length.
2. Machines designed specifically as jig grinders having any of the following characteristics:
a. The c-axis is used to maintain the grinding wheel normal to the work surface; or
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b. The a-axis is configured to grind barrel cams.
3. Tool or cutter grinding machines shipped as complete systems with "software" specially designed for the production of tools or cutters.4. Crank shaft or cam shaft grinding machines.
5. Surface grinders.
d. Electrical discharge machines (EDM) of the non-wire type which have two or more rotary axes which can be coordinated simultaneously for "contouring control";
e. Machine tools for removing metals, ceramics or "composites":1. By means of:a. Water or other liquid jets, including those employing abrasive additives;b. Electron beam; or
c. "Laser" beam; and
2. Having two or more rotary axes which:
a. Can be coordinated simultaneously for "contouring control"; andb. Have a positioning accuracy of less (better) than 0.003°;
f. Deep-hole-drilling machines and turning machines modified for deep-hole-drilling, having a maximum depth-of-bore capability exceeding 5,000 mm and specially designed components therefor.
2.B.2. Non-"numerically controlled" machine tools for generating optical quality surfaces, as follows, and specially designed components therefor:
a. Turning machines using a single point cutting tool and having all of the following characteristics:1. Slide positioning accuracy less (better) than 0.0005 mm per 300 mm of travel;2. Bidirectional slide positioning repeatability less (better) than 0.00025 mm per 300 mm of travel;
3. Spindle "run out" and "camming" less (better) than 0.0004 mm TIR;
4. Angular deviation of the slide movement (yaw, pitch and roll) less (better) than 2 seconds of arc, TIR, over full travel; and
5. Slide perpendicularity less (better) than 0.001 mm per 300 mm of travel;
Technical Note
The bidirectional slide positioning repeatability (R) of an axis is the maximum value of the repeatability of positioning at any position along or around the axis determined using the procedure and under the conditions specified in part 2.11 of ISO 230/2: 1988.
b. Fly cutting machines having all of the following characteristics:
1. Spindle "run out" and "camming" less (better) than 0.000 mm TIR; and
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2. Angular deviation of slide movement (yaw, pitch and roll) less (better) than 2 seconds of arc, TIR, over full travel.
2.B.3. "Numerically controlled" or manual machine tools, and specially designed components, controls and accessories therefor, specially designed for the shaving, finishing, grinding or honing of hardened (Rc = 40 or more) spur, helical and double-helical gears with a pitch diameter exceeding 1,250 mm and a face width of 15% of pitch diameter or larger finished to a quality of AGMA 14 or better (equivalent to ISO 1328 class 3).
2.B.4. Hot "isostatic presses", having all of the following, and specially designed dies, moulds, components, accessories and controls therefor:
a. A controlled thermal environment within the closed cavity and possessing a chamber cavity with an inside diameter of 406 mm or more; andb. Any of the following:
1. A maximum working pressure exceeding 207 MPa;2. A controlled thermal environment exceeding 1,773 K (1,500°C); or
3. A facility for hydrocarbon impregnation and removal of resultant gaseous degradation products.
Technical Note
The inside chamber dimension is that of the chamber in which both the working temperature and the working pressure are achieved and does not include fixtures. That dimension will be the smaller of either the inside diameter of the pressure chamber or the inside diameter of the insulated furnace chamber, depending on which of the two chambers is located inside the other.
2.B.5. Equipment specially designed for the deposition, processing and in-process control of inorganic overlays, coatings and surface modifications, as follows, for non-electronic substrates, by processes shown in the Table and associated Notes following 2.E.3.f., and specially designed automated handling, positioning, manipulation and control components therefor:
a. "Stored programme controlled" chemical vapour deposition (CVD) production equipment having all of the following:1. Process modified for one of the following:a. Pulsating CVD;b. Controlled nucleation thermal decomposition (CNTD); or
c. Plasma enhanced or plasma assisted CVD; and
2. Any of the following:
a. Incorporating high vacuum (equal to or less than 0.01 Pa) rotating seals; orb. Incorporating in situ coating thickness control;
b. "Stored programme controlled" ion implantation production equipment having beam currents of 5 mA or more;
c. "Stored programme controlled" electron beam physical vapour deposition (EB-PVD) production equipment incorporating all of the following:
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1. Power systems rated for over 80 kW;2. A liquid pool level "laser" control system which regulates precisely the ingots feed rate; and
3. A computer controlled rate monitor operating on the principle of photo-luminescence of the ionised atoms in the evaporant stream to control the deposition rate of a coating containing two or more elements;
d. "Stored programme controlled" plasma spraying production equipment having any of the following characteristics:
1. Operating at reduced pressure controlled atmosphere (equal to or less than 10 kPa measured above and within 300 mm of the gun nozzle exit) in a vacuum chamber capable of evacuation down to 0.01 Pa prior to the spraying process; or2. Incorporating in situ coating thickness control;
e. "Stored programme controlled" sputter deposition production equipment capable of current densities of 0.1 mA/mm2 or higher at a deposition rate of 15 µm/h or more;
f. "Stored programme controlled" cathodic arc deposition production equipment incorporating a grid of electromagnets for steering control of the arc spot on the cathode;
g. "Stored programme controlled" ion plating production equipment allowing for the in situ measurement of any of the following:
1. Coating thickness on the substrate and rate control; or2. Optical characteristics.
Note 2.B.5.a., 2.B.5.b., 2.B.5.e., 2.B.5.f., and 2.B.5.g. do not control chemical vapour deposition, cathodic arc, sputter deposition, ion plating or ion implantation equipment specially designed for cutting or machining tools.
2.B.6. Dimensional inspection or measuring systems and equipment, as follows:
a. Computer controlled, "numerically controlled" or "stored programme controlled" dimensional inspection machines, having a three dimensional length (volumetric) "measurement uncertainty" equal to or less (better) than (1.7 + L/1,000) µm (L is the measured length in mm) tested according to ISO 10360-2;b. Linear and angular displacement measuring instruments, as follows:
1. Linear measuring instruments having any of the following:a. Non-contact type measuring systems with a "resolution" equal to or less (better) than 0.2 µm within a measuring range up to 0.2 mm;b. Linear voltage differential transformer systems having all of the following characteristics:
1. "Linearity" equal to or less (better) than 0.1% within a measuring range up to 5 mm; and2. Drift equal to or less (better) than 0.1% per day at a standard ambient test room temperature ± 1 K; or
c. Measuring systems having all of the following:
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1. Containing a "laser"; and2. Maintaining, for at least 12 hours, over a temperature range of ± 1 K around a standard temperature and at a standard pressure, all of the following:
a. A "resolution" over their full scale of 0.1 µm or less (better); andb. A "measurement uncertainty" equal to or less (better) than (0.2 + L/2,000) µm (L is the measured length in mm);
Note 2.B.6.b.1. does not control measuring interferometer systems, without closed or open loop feedback, containing a "laser" to measure slide movement errors of machine-tools, dimensional inspection machines or similar equipment.
2. Angular measuring instruments having an "angular position deviation" equal to or less (better) than 0.00025°;Note 2.B.6.b.2. does not control optical instruments, such as autocollimators, using collimated light to detect angular displacement of a mirror.
c. Equipment for measuring surface irregularities, by measuring optical scatter as a function of angle, with a sensitivity of 0.5 nm or less (better).Note 1 Machine tools which can be used as measuring machines are controlled if they meet or exceed the criteria specified for the machine tool function or the measuring machine function.
Note 2 A machine described in 2.B.6. is controlled if it exceeds the control threshold anywhere within its operating range.
2.B.7. "Robots" having any of the following characteristics and specially designed controllers and "end-effectors" therefor:
a. Capable in real time of full three-dimensional image processing or full three-dimensional scene analysis to generate or modify "programmes" or to generate or modify numerical programme data;Note The scene analysis limitation does not include approximation of the third dimension by viewing at a given angle, or limited grey scale interpretation for the perception of depth or texture for the approved tasks (2 1/2 D).
b. Specially designed to comply with national safety standards applicable to explosive munitions environments;
c. Specially designed or rated as radiation-hardened to withstand greater than 5 x 103 Gy (Si) without operational degradation; or
d. Specially designed to operate at altitudes exceeding 30,000 m.
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2.B.8. Assemblies, units or inserts specially designed for machine tools, or for equipment specified in 2.B.6. or 2.B.7., as follows:
a. Linear position feedback units (e.g., inductive type devices, graduated scales, infrared systems or "laser" systems) having an overall "accuracy" less (better) than (800 + (600 x L x 10-3)) nm (L equals the effective length in mm);Note For "laser" systems see also Note to 2.B.6.b.1.
b. Rotary position feedback units (e.g., inductive type devices, graduated scales, infrared systems or "laser" systems) having an "accuracy" less (better) than 0.00025°;
Note For "laser" systems see also Note to 2.B.6.b.1.
c. "Compound rotary tables" and "tilting spindles", capable of upgrading, according to the manufacturer's specifications, machine tools to or above the levels specified in 2.B.
2.B.9. Spin-forming machines and flow-forming machines, which, according to the manufacturer's technical specification, can be equipped with "numerical control" units or a computer control and having all of the following:
a. Two or more controlled axes of which at least two can be coordinated simultaneously for "contouring control"; and
b. A roller force more than 60 kN.Technical Note
Machines combining the function of spin-forming and flow-forming are for the purpose of 2.B.9. regarded as flow-forming machines.
2.C. MATERIALS - None.
2.D. SOFTWARE
2.D.1. "Software" specially designed or modified for the "development", "production" or "use" of equipment specified in 2.A. or 2.B.
2.D.2. "Software" for electronic devices, even when residing in an electronic device or system, enabling such devices or systems to function as a "numerical control" unit, capable of any of the following:
a. Coordinating simultaneously more than 4 axes for "contouring control"; orb. "Real time processing" of data to modify tool path, feed rate and spindle data, during the machining operation, by any of the following:
1. Automatic calculation and modification of part program data for machining in two or more axes by means of measuring cycles and access to source data; or2. "Adaptive control" with more than one physical variable measured and processed by means of a computing model (strategy) to change one or more machining instructions to optimize the process.
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Note 2.D.2. does not control "software" specially designed or modified for the operation of machine tools not controlled by Category 2.
2.E. TECHNOLOGY
2.E.1. "Technology" according to the General Technology Note for the "development" of equipment or "software" specified in 2.A., 2.B. or 2.D.
2.E.2. "Technology" according to the General Technology Note for the "production" of equipment specified in 2.A. or 2.B.
2.E.3. Other "technology", as follows:
a. "Technology" for the "development" of interactive graphics as an integrated part in "numerical control" units for preparation or modification of part programmes;b. "Technology" for metal-working manufacturing processes, as follows:
1. "Technology" for the design of tools, dies or fixtures specially designed for any of the following processes:a. "Superplastic forming";b. "Diffusion bonding"; or
c. "Direct-acting hydraulic pressing";
2. Technical data consisting of process methods or parameters as listed below used to control:
a. "Superplastic forming" of aluminium alloys, titanium alloys or "superalloys":1. Surface preparation;2. Strain rate;
3. Temperature;
4. Pressure;
b. "Diffusion bonding" of "superalloys" or titanium alloys:
1. Surface preparation;2. Temperature;
3. Pressure;
c. "Direct-acting hydraulic pressing" of aluminium alloys or titanium alloys:
1. Pressure;2. Cycle time;
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d. "Hot isostatic densification" of titanium alloys, aluminium alloys or "superalloys":1. Temperature;2. Pressure;
3. Cycle time;
c. "Technology" for the "development" or "production" of hydraulic stretch-forming machines and dies therefor, for the manufacture of airframe structures;d. "Technology" for the "development" of generators of machine tool instructions (e.g., part programmes) from design data residing inside "numerical control" units;
e. "Technology for the development" of integration "software" for incorporation of expert systems for advanced decision support of shop floor operations into "numerical control" units;
f. "Technology" for the application of inorganic overlay coatings or inorganic surface modification coatings (specified in column 3 of the following table) to non-electronic substrates (specified in column 2 of the following table), by processes specified in column 1 of the following table and defined in the Technical Note.
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TABLE - DEPOSITION TECHNIQUES
1. Coating Process (1)* 2. Substrate 3. Resultant Coating
A. Chemical Vapour "Superalloys" Aluminides for internal
Deposition (CVD) passages
Ceramics and Low- Silicides
expansion glasses(14) Carbides
Dielectric layers (15)
Carbon-carbon, Silicides
Ceramic and Carbides
Metal "matrix" Refractory metals
"composites" Mixtures thereof (4)
Dielectric layers (15)
Aluminides
Alloyed aluminides (2)
Cemented tungsten Carbides
carbide (16), Tungsten
Silicon carbide Mixtures thereof (4)
Dielectric layers (15)
Molybdenum and Dielectric layers (15)
Molybdenum alloys
Beryllium and Dielectric layers (15)
Beryllium alloys
Sensor window Dielectric layers (15)
materials (9)
___________________________________________________________________________
B. Thermal-Evaporation
Physical Vapour
Deposition (TE-PVD)
1. Physical Vapour "Superalloys" Alloyed silicides
Deposition (PVD): Alloyed aluminides (2)
Electron-Beam MCrAlX (5)
(EB-PVD) Modified zirconia (12)
Silicides
Aluminides
Mixtures thereof (4)
* The numbers in parenthesis refer to the Notes following this Table.
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TABLE - DEPOSITION TECHNIQUES
1. Coating Process (1) 2. Substrate 3. Resultant Coating
B.1. (continued) Ceramics and Low- Dielectric layers (15)
expansion glasses
(14)
Corrosion resistant MCrAlX (5)
steel (7) Modified zirconia (12)
Mixtures thereof (4)
Carbon-carbon, Silicides
Ceramic and Carbides
Metal "matrix" Refractory metals
"composites" Mixtures thereof (4)
Dielectric layers (15)
Cemented tungsten Carbides
carbide (16), Tungsten
Silicon carbide Mixtures thereof (4)
Dielectric layers (15)
Molybdenum and Dielectric layers (15)
Molybdenum alloys
Beryllium and Dielectric layers (15)
Beryllium alloys Borides
Sensor window Dielectric layers (15)
materials (9)
Titanium alloys (13) Borides
Nitrides
_____________________________________________________________________________
B.2. Ion assisted Ceramics and Low- Dielectric layers (15)
resistive heating expansion glasses (14)
Physical Vapour
Deposition (lon
Plating)
Carbon-carbon, Dielectric layers (15)
Ceramic and
Metal "matrix"
"composites"
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TABLE - DEPOSITION TECHNIQUES
1. Coating Process (1) 2. Substrate 3. Resultant Coating
B.2. (continued) Cemented tungsten Dielectric layers (15)
carbide (16),
Silicon carbide
Molybdenum and
Molybdenum alloys Dielectric layers (15)
Beryllium and
Beryllium alloys Dielectric layers (15)
Sensor window Dielectric layers (15)
materials (9)
_____________________________________________________________________________
B.3. Physical Vapour Ceramics and Low- Silicides
Deposition: expansion glasses (14) Dielectric layers (15)
"laser" evaporation
Carbon-carbon, Dielectric layers (15)
Ceramic and
Metal "matrix"
"composites
Cemented tungsten Dielectric layers (15)
carbide (16),
Silicon carbide
Molybdenum and Dielectric layers (15)
Molybdenum alloys
Beryllium and Dielectric layers (15)
Beryllium alloys
Sensor window Dielectric layers (15)
materials (9) Diamond-like carbon
_____________________________________________________________________________
B.4. Physical "Superalloys" Alloyed silicides
Vapour Deposition: Alloyed aluminides (2)
cathodic arc discharge MCrAlX (5)
Polymers (11) and Borides
Organic"matrix" Carbides
"composites" Nitrides
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TABLE - DEPOSITION TECHNIQUES
1. Coating Process (1) 2. Substrate 3. Resultant Coating
C. Pack cementation Carbon-carbon, Silicides
(see A above for Ceramic and Carbides
out-of-pack Metal "matrix" Mixtures thereof (4)
cementation) (10) "composites"
Titanium alloys (13) Silicides
Aluminides
Alloyed aluminides (2)
Refractory metals Silicides
and alloys (8) Oxides
_____________________________________________________________________________
D. Plasmaspraying "Superalloys" MCrAlX (5)
Modified zirconia (12)
Mixtures thereof (4)
Abradable Nickel-
Graphite
Abradable
Ni-Cr-AI-Bentonite
Abradable Al-Si-
Polyester
Alloyed aluminides (2)
Aluminium alloys (6) MCrAlX (5)
Modified zirconia (12)
Silicides
Mixtures thereof (4)
Refractory metals Aluminides
and alloys (8) Silicides
Carbides
Corrosion resistant
steel (7) Modified zirconia (12)
Mixtures thereof (4)
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TABLE - DEPOSITION TECHNIQUES
1. Coating Process (1) 2. Substrate 3. Resultant Coating
D. (continued) Titanium alloys (13) Carbides
Aluminides
Silicides
Alloyed aluminides (2)
Abradable Nickel-
Graphite
Abradable
Ni-Cr-AI-Bentonite
Abradable Al-Si-Polyester
Polyester
_____________________________________________________________________________
E. Slurry Deposition Refractory metals Fused silicides
and alloys (8) Fused aluminides
except for resistance
heating elements
Carbon-carbon, Silicides
Ceramic and Carbides
Metal "matrix" Mixtures thereof (4)
"composites "
______________________________________________________________________________
F. Sputter Deposition "Superalloys" Alloyed silicides
Alloyed aluminides (2)
Noble metal modified
aluminides (3)
MCrAlX (5)
Modified zirconia (12)
Platinum
Mixtures thereof (4)
Ceramics and Low- Silicides
expansion glasses Platinum
(14) Mixtures thereof (4)
Dielectic layers (15)
Titanium alloys (13) Borides
Nitrides
Oxides
Silicides
Aluminides
Alloyed aluminides (2)
Carbides
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TABLE - DEPOSITION TECHNIQUES
1. Coating Process (1) 2. Substrate 3. Resultant Coating
F. (continued) Carbon-carbon, Silicides
Ceramic and Carbides
Metal "matrix" Refractory metals
"composites" Mixtures thereof (4)
Dielectric layers (15)
Cemented tungsten Carbides
carbide (16), Tungsten
Silicon carbide Mixtures thereof (4)
Dielectric layers (15)
Molybdenum and
Molybdenum alloys Dielectric layers (15)
Beryllium and Borides
Beryllium alloys Dielectric layers (15)
Sensor window Dielectric layers (15)
materials (9)
Refractory metals Aluminides
and alloys (8) Silicides
Oxides
Carbides
____________________________________________________________________________
G. Ion Implantation High temperature Additions of
bearing steels Chromium
Tantalum or
Niobium (Columbium)
Titanium alloys (13) Borides
Nitrides
Beryllium and Borides
Beryllium alloys
Cemented tungsten Carbides
carbide (16) Nitrides
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TABLE - DEPOSITION TECHNIQUES - NOTES
1. The term 'coating process' includes coating repair and refurbishing as well as original coating.
2. The term 'alloyed aluminide coating' includes single or multiple-step coatings in which an element or elements are deposited prior to or during application of the aluminide coating, even if these elements are deposited by another coating process. It does not, however, include the multiple use of single-step pack cementation processes to achieve alloyed aluminides.
3. The term 'noble metal modified aluminide' coating includes multiple-step coatings in which the noble metal or noble metals are laid down by some other coating process prior to application of the aluminide coating.
4. Mixtures consist of infiltrated material, graded compositions, co-deposits and multilayer deposits and are obtained by one or more of the coating processes specified in the Table.
5. MCrAlX refers to a coating alloy where M equals cobalt, iron, nickel or combinations thereof and X equals hafnium, yttrium, silicon, tantalum in any amount or other intentional additions over 0.01 weight percent in various proportions and combinations, except:
a. CoCrAlY coatings which contain less than 22 weight percent of chromium, less than 7 weight percent of aluminium and less than 2 weight percent of yttrium;b. CoCrAlY coatings which contain 22 to 24 weight percent of chromium, 10 to 12 weight percent of aluminium and 0.5 to 0.7 weight percent of yttrium; or
c. NiCrAlY coatings which contain 21 to 23 weight percent of chromium, 10 to 12 weight percent of aluminium and 0.9 to1.1 weight percent of yttrium.
6. The term 'aluminium alloys' refers to alloys having an ultimate tensile strength of 190 MPa or more measured at 293 K (20°C).
7. The term 'corrosion resistant steel' refers to AISI (American Iron and Steel Institute) 300 series or equivalent national standard steels.
8. Refractory metals consist of the following metals and their alloys: niobium (columbium), molybdenum, tungsten and tantalum.
9. Sensor window materials, as follows: alumina, silicon, germanium, zinc sulphide, zinc selenide, gallium arsenide and the following metal halides: potassium iodide, potassium fluoride, or sensor window materials of more than 40 mm diameter for thallium bromide and thallium chlorobromide.
10. "Technology" for single-step pack cementation of solid airfoils is not controlled by Category 2.
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11. Polymers, as follows: polyimide, polyester, polysulphide, polycarbonates and polyurethanes.
12. Modified zirconia refers to additions of other metal oxides (e.g., calcia, magnesia, yttria, hafnia, rare earth oxides) to zirconia in order to stabilise certain crystallographic phases and phase compositions. Thermal barrier coatings made of zirconia, modified with calcia or magnesia by mixing or fusion, are not controlled.
13. Titanium alloys refers to aerospace alloys having an ultimate tensile strength of 900 MPa or more measured at 293 K (20°C).
14. Low-expansion glasses refers to glasses which have a coefficient of thermal expansion of 1 x 10-7 K-1 or less measured at 293 K (20°C).
15. Dielectric layers are coatings constructed of multi-layers of insulator materials in which the interference properties of a design composed of materials of various refractive indices are used to reflect, transmit or absorb various wavelength bands. Dielectric layers refers to more than four dielectric layers or dielectric/metal "composite" layers.
16. Cemented tungsten carbide does not include cutting and forming tool materials consisting of tungsten carbide/(cobalt, nickle), titanium carbide/(cobalt, nickle), chromium carbide/nickle-chromium and chromium carbide/nickle.
TABLE - DEPOSITION TECHNIQUES - TECHNICAL NOTE
Processes specified in Column 1of the Table are defined as follows:
a. Chemical Vapour Deposition (CVD) is an overlay coating or surface modification coating process wherein a metal, alloy, "composite", dielectric or ceramic is deposited upon a heated substrate. Gaseous reactants are decomposed or combined in the vicinity of a substrate resulting in the deposition of the desired elemental, alloy or compound material-on the substrate. Energy for this decomposition or chemical reaction process may be provided by the heat of the substrate, a glow discharge plasma, or "laser" irradiation.
N.B.1 CVD includes the following processes: directed gas flow out-of-pack deposition, pulsating CVD, controlled nucleation thermal decomposition (CNTD), plasma enhanced or plasma assisted CVD processes.N.B.2 Pack denotes a substrate immersed in a powder mixture.
N.B.3 The gaseous reactants used in the out-of-pack process are produced using the same basic reactions and parameters as the pack cementation process, except that the substrate to be coated is not in contact with the powder mixture.
b. Thermal Evaporation-Physical Vapour Deposition (TE-PVD) is an overlay coating process conducted in a vacuum with a pressure less than 0.1 Pa wherein a source of thermal energy is used to vaporize the coating material. This process results in the condensation, or deposition, of the evaporated species onto appropriately positioned substrates.
The addition of gases to the vacuum chamber during the coating process to synthesize compound coatings is an ordinary modification of the process.
The use of ion or electron beams, or plasma to activate or assist the coating's deposition is also a common modification in this technique. The use of monitors to provide in-process measurement of optical characteristics and thickness of coatings can be a feature of these processes.
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TABLE - DEPOSITION TECHNIQUES - TECHNICAL NOTE
Processes specified in Column 1 of the Table - continued:
b. Specific TE-PVD processes are as follows:
1. Electron Beam PVD uses an electron beam to heat and evaporate the material which forms the coating;2. Resistive Heating PVD employs electrically resistive heating sources capable of producing a controlled and uniform flux of evaporated coating species;
3. "Laser" Evaporation uses either pulsed or continuous wave "laser" beams to heat the material which forms the coating;
4. Cathodic Arc Deposition employs a consumable cathode of the material which forms the coating and has an arc discharge established on the surface by a momentary contact of a ground trigger. Controlled motion of arcing erodes the cathode surface creating a highly ionized plasma. The anode can be either a cone attached to the periphery of the cathode, through an insulator, or the chamber. Substrate biasing is used for non line-of-sight deposition.
N.B. This definition does not include random cathodic arc deposition with non-biased substrates.c. Ion Plating is a special modification of a general TE-PVD process in which a plasma or an ion source is used to ionize the species to be deposited, and a negative bias is applied to the substrate in order to facilitate the extraction of the species to be deposited from the plasma. The introduction of reactive species, evaporation of solids within the process chamber, and the use of monitors to provide in-process measurement of optical characteristics and thicknesses of coatings are ordinary modifications of the process.
d. Pack Cementation is a surface modification coating or overlay coating process wherein a substrate is immersed in a powder mixture (a pack), that consists of:1. The metallic powders that are to be deposited (usually aluminium, chromium, silicon or combinations thereof);2. An activator (normally a halide salt); and
3. An inert powder, most frequently alumina.
The substrate and powder mixture is contained within a retort which is heated to between 1,030 K (757°C) and 1,375 K (1,102°C) for sufficient time to deposit the coating.
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TABLE - DEPOSITION TECHNIQUES - TECHNICAL NOTE
Processes specified in Column 1 of the Table - continued:
e. Plasma Spraying is an overlay coating process wherein a gun (spray torch) which produces and controls a plasma accepts powder or wire coating materials, melts them and propels them towards a substrate, whereon an integrally bonded coating is formed. Plasma spraying constitutes either low pressure plasma spraying or high velocity plasma spraying carried out under-water.N.B. 1 Low pressure means less than ambient atmospheric pressure.N.B. 2 High velocity refers to nozzle-exit gas velocity exceeding 750 m/s calculated at 293 K (20°C) at 0.1 MPa.
f. Slurry Deposition is a surface modification coating or overlay coating process wherein a metallic or ceramic powder with an organic binder is suspended in a liquid and is applied to a substrate by either spraying, dipping or painting, subsequent air or oven drying, and heat treatment to obtain the desired coating.
g. Sputter Deposition is an overlay coating process based on a momentum transfer phenomenon, wherein positive ions are accelerated by an electric field towards the surface of a target (coating material). The kinetic energy of the impacting ions is sufficient to cause target surface atoms to be released and deposited on an appropriately positioned substrate.N.B.1 The Table refers only to triode, magnetron or reactive sputter deposition which is used to increase adhesion of the coating and rate of deposition and to radio frequency (RF) augmented sputter deposition used to permit vapourisation of non-metallic coating materials.N.B.2 Low-energy ion beams (less than 5 keV) can be used to activate the deposition.
h. Ion Implantation is a surface modification coating process in which the element to be alloyed is ionized, accelerated through a potential gradient and implanted into the surface region of the substrate. This includes processes in which ion implantation is performed simultaneously with electron beam physical vapour deposition or sputter deposition.
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TABLE - DEPOSITION TECHNIQUES - STATEMENT OF UNDERSTANDING
It is understood that the following technical information, accompanying the table of deposition techniques, is for use as appropriate.
1. "Technology" for pretreatments of the substrates listed in the Table, as follows:
a. Chemical stripping and cleaning bath cycle parameters, as follows:1. Bath compositiona. For the removal of old or defective coatings, corrosion product or foreign deposits;b. For preparation of virgin substrates;
2. Time in bath;
3 . Temperature of bath;
4. Number and sequences of wash cycles;
b. Visual and macroscopic criteria for acceptance of the cleaned part;
c. Heat treatment cycle parameters, as follows:
1. Atmosphere parameters, as follows:a. Composition of the atmosphere;b. Pressure of the atmosphere;
2. Temperature for heat treatment;
3. Time of heat treatment;
d. Substrate surface preparation parameters, as follows:
1. Grit blasting parameters, as follows:a. Grit composition;b. Grit size and shape;
c. Grit velocity;
2. Time and sequence of cleaning cycle after grit blast;
3. Surface finish parameters;
e. Masking technique parameters, as follows:
1. Material of mask;2. Location of mask;
2. "Technology" for in situ quality assurance techniques for evaluation of the coating processes listed in the Table, as follows:
a. Atmosphere parameters, as follows:1. Composition of the atmosphere;2. Pressure of the atmosphere;
b . Time parameters;
c. Temperature parameters;
d. Thickness parameters;
e. Index of refraction parameters;
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TABLE - DEPOSITION TECHNIQUES - STATEMENT OF UNDERSTANDING
3. "Technology" for post deposition treatments of the coated substrates listed in the Table, as follows:
a. Shot peening parameters, as follows:1. Shot composition;2. Shot size;
3. Shot velocity;
b. Post shot peening cleaning parameters;
c. Heat treatment cycle parameters, as follows:
1. Atmosphere parameters, as follows:a. Composition of the atmosphere;b. Pressure of the atmosphere;
2. Time-temperature cycles;
d. Post heat treatment visual and macroscopic criteria for acceptance of the coated substrates;
4. "Technology" for quality assurance techniques for the evaluation of the coated substrates listed in the Table, as follows:
a. Statistical sampling criteria;b. Microscopic criteria for:
1. Magnification;2. Coating thickness uniformity;
3. Coating integrity;
4. Coating composition;
5. Coating and substrates bonding;
6 . Microstructural uniformity.
c. Criteria for optical properties assessment:
1. Reflectance;2. Transmission;
3. Absorption;
4. Scatter;
5. "Technology" and parameters related to specific coating and surface modification processes listed in the Table, as follows:
a. For Chemical Vapour Deposition:1. Coating source composition and formulation;2. Carrier gas composition;
3 . Substrate temperature;
4. Time-temperature-pressure cycles;
5. Gas control and part manipulation;
b. For Thermal Evaporation - Physical Vapour Deposition:
1. Ingot or coating material source composition;2 . Substrate temperature;
3. Reactive gas composition;
4 Ingot feed rate or material evaporation rate;
5. Time-temperature pressure cycles;
6. Beam and part manipulation;
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TABLE - DEPOSITION TECHNIQUES - STATEMENT OF UNDERSTANDING
5. b.
7. "Laser" parameters, as follows:a. Wave length;b. Power density;
c. Pulse length;
d . Repetition ratio;
e. Source;
f. Substrate orientation;
c. For Pack Cementation:1. Pack composition and formulation;2. Carrier gas composition;
3. Time-temperature-pressure cycles;
d. For Plasma Spraying:
1. Powder composition, preparation and size distributions;2. Feed gas composition and parameters;
3. Substrate temperature;
4. Gun power parameters;
5. Spray distance;
6. Spray angle;
7. Cover gas composition, pressure and flow rates;
8. Gun control and part manipulation;
e. For Sputter Deposition:
1. Target composition and fabrication;2. Geometrical positioning of part and target;
3. Reactive gas composition;
4. Electrical bias;
5. Time-temperature-pressure cycles;
6. Triode power;
7. Part manipulation;
f. For Ion Implantation:
1. Beam control and part manipulation;2. Ion source design details;
3. Control techniques for ion beam and deposition rate parameters;
4. Time-temperature-pressure cycles.
g. For Ion Plating:
1. Beam control and part manipulation;2. Ion source design details;
3. Control techniques for ion beam and deposition rate parameters;
4. Time-temperature-pressure cycles;
5. Coating material feed rate and vaporisation rate;
6. Substrate temperature;
7. Substrate bias parameters.
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